Copper pyrophosphate

Technology of non-cyanide Cu-Zn-Sn-Ni tetrabasic alloy imitative gold electroplating on FRP was studied using potassium pyrophosphate as main complexing agent , potassium sodium tartrate as auxiliary complexing agent and laboratory-synthesized copper pyrophosphate and zinc pyrophosphate as main salts .

以焦磷酸钾为主络合剂、酒石酸钾钠为辅助络合剂，自制焦磷酸铜、焦磷酸锌为主盐进行了玻璃钢无氰Cu-Zn-Sn-Ni四元合金电镀工艺研究。

Investigation of Electroplating Copper in Pyrophosphate on Magnesium Alloy

镁合金焦磷酸盐镀铜工艺的研究

The electrode processes of copper electrodeposition for pyrophosphate solution ⅲ . the study by rotating electrode method

焦磷酸盐溶液中铜电沉积过程Ⅱ.用旋转电极的研究

An analytical procedure and calculation method on the content of copper , total pyrophosphate , phosphate and ammonium citrate in pyrophosphate copper plating bath were given .

介绍了一种焦磷酸盐镀铜溶液中铜、总焦磷酸根、磷酸根、柠檬酸铵含量的分析方法和计算方法。